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Meta Etchant-MetaBiomed-Korea
Meta Etchant 3g x 3 syringes
Disposable stainless tips 20 ea250 EGP -
CharmFil plus® A3.5-Dentkist- Korea
CharmFil 4g * 1 syringe
250 EGP -
CharmEtch -Dentkist -Korea
Packaning
CharmEtch- 37% 3 ml * 3 syringes
Disposable tips250 EGP -
Charm Sensy®-Dentkist-Korea
Light Curing desensitizing Agent
CharmSensy 5m * 1 bottle
Microbrush * 1pack
– Special technology based upon desensitizing agent – Treatment of hypersensitivity
– Prevent from second caries as containing fluoride
– Low abration
– Perfect mechanical and chemical properties
– High adhesion
– Permanent sealing on dentin tubes
– Biocompatible
260 EGP -
CharmBond®-Dentkist-Korea
CharmBond 5ml * 2 bottles
265 EGP -
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CharmFil plus® A1-Dentkist- Korea
CharmFil 4g * 1 syringe
290 EGP -
CharmFil plus® A2-Dentkist -Korea
CharmFil 4g * 1 syringe
290 EGP -
CharmFil plus® A3-Dentkist – Korea
CharmFil 4g * 1 syringe
290 EGP -
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Quicks® Yellow-Dentkist-Korea
Light Cure Temporary Filling Material
3g*3 Syrings
– Easy removal and exclusion of application
– Easy removal in one piece
– Excellent sealing effect
– Easy application
– Save time / economical system330 EGP400 EGP -
Quicks® Blue-Dentkist-Korea
Light Cure Temporary Filling Material
3g*3 Syrings
– Easy removal and exclusion of application
– Easy removal in one piece
– Excellent sealing effect
– Easy application
– Save time / economical system330 EGP400 EGP -
Kenda C.G.I.-KENDA Polishers-Swiss
3-step polishing system for universal composites, compomers and glass-ionomers.
7 PCS380 EGP -
Kenda Zircovis-KENDA Polishers-Swiss
2-step diamond polishing system for all oxide & Silicate Ceramics – optimized for Zirconia
380 EGP -
Porcelain Bonding Resin-Bisco-USA
Porcelain Bonding Resin is a HEMA-Free, hydrophobic bonding resin designed specifically for bonding to porcelain. Placed in a thin layer on the silane-treated intaglio surface of the restoration, Porcelain Bonding Resin will act as a wetting resin allowing the cement to spread in a more uniform layer.
400 EGP -
All-Bond Universal® 0.5ml-Bisco-USA
All-Bond SE is a light-cured adhesive that can be used in both self- and selective-etch modes. It combines etching, priming and bonding in one application.
420 EGP -